NanoFrazor
The NanoFrazor system is a state-of-the-art nanopatterning tool based on local thermal evaporation of the thermal resist using the tip of an AFM. A current is applied to locally heat the AFM tip and transfer heat to the PPA layer and sublimate this layer, making a nanopattern. The resolution of this technique is 50 nm. The system is small in size, compact, and robust to incorporate inside a glove box to fabricate nanodevice of air-sensitive materials.
µMLA -micron photolithography tool uses a 365nm LED to pattern a photosensitive resist. LED is mounted on a moving head which rasters over the sample to generate the desired pattern without the need for any mask. The resolution of this tool is 600nm. uMLA has a fast writing speed of 10mm2/min.
Xactix is a dry etching tool that uses various process gases to etch metal, semiconductor, and dielectric materials. The tool allows good control of etching rate as well as the selectivity of the etching material.
Wire Bonder
This machine is a versatile and reliable tool designed for challenging die-attach applications in industries such as RF, microwave, semiconductor, hybrid, and medical devices. It features a gantry-style chassis, a capacitive touchscreen interface, and an 8:1 ratio, purely orthogonal X-Y-Z micromanipulator for precise die placement, with convertibility for both epoxy and eutectic die bonding and programmability for efficient operation.
AJA thin film deposition tool is a high vacuum system that can deposit thin films with two different methods., namely Sputtering and electron beam (e-beam) deposition. Sputtering of various elemental films can be performed using 2 RF and 2 DC sputtering guns. The e-beam system has 6 pocket crucibles. In addition to thin film deposition, the system also consists of argon ion milling capability to clean or etch in situ.